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The Tescan MIRA3 SEM (Scanning Electron Microscope) with Picoindenter offers remarkable features designed for advanced materials analysis, including a maximum accelerating voltage of 30kV and exceptional resolution down to 1.2nm. This instrument is equipped with various detectors, including Secondary Electron Imaging and Backscattered Electron Detection, which facilitate versatile imaging capabilities across different modes, catering to high-resolution and large field-of-view requirements. Users benefit from the integrated Picoindenter, which enables precise nanomechanical testing with load capabilities of up to 500mN and an impressive maximum displacement of 150µm. The spacious sample chamber, with a maximum specimen height of 145mm, allows for the examination of larger samples, broadening testing possibilities across multiple applications in materials science. Overall, the combination of high-resolution imaging and detailed mechanical characterization makes the MIRA3 SEM an invaluable tool for researchers seeking in-depth insights into material properties and behaviors.
Features | Specifications |
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Accelerating Voltage | 0-30kV |
Filament | Schottky Field Emitter |
Detectors | Secondary Electron Imaging – Everhart-Thornley Detector (ETD), Backscattered Electron Detector (WD > 8mm), EDS (WD = 15mm) – EDAX, EBSD (WD= 10-20mm) – EDAX Hikari Camera |
SEM Resolution | 1.2nm |
Imaging mode Resolution Mode (WD = 5-10mm) | high resolution and low depth of focus |
Depth Mode | good resolution and increased depth of focus |
Field Mode | large field of view, high depth of focus but worse resolution |
Wide Field Mode (WD >25mm) | extra large field of view but focus is not accurate |
GM Chamber and Sample Stage Internal Diameter | 340mm (width) x 315mm (depth) |
Maximum Specimen Height |
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Maximum Specimen Weight | up to 8kg |
Movement |
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Tilt | +/- 90 degree |
Vacuum | Sputter Ion Pump for FEG and Molecular Drag Pump for chamber and column |
PC and Software | SEM PC MIRA3 Control Software, EDAX PC TEAM for EDS and EBSD, OIM Analysis on EDAX PC for EBSD data analysis |
Low Load Transducer | maximum 15mN indent / 14mN tensile |
High Load Transducer | maximum 500mN indent / 100mN tensile |
Maximum Displacement | 150um |
Force Noise Floor inside SEM | LL <0.4uN, HL<5uN |
Force Noise Floor in ideal case | LL<50nN |
Displacement Noise Floor inside SEM | <1nm |
Displacement Noise Floor in ideal case | <0.1nm |
Sample Positioning Range | 12mm (Z) x 26mm(X) x 29mm(Y indentation axis) |
Tilt-rotation stage | maximum 400mN |
In-situ heating elements | indentation at temperature up to 800C |
Probes | Standard Berkovich (1), Flat-end (3): 1um, 5um, 20um, Cube corner (1), Cono-spherical (1) tip radius less than 1um, 800C Berkovich (1) for heating stage only |
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