Mat-Nova

Tescan - MIRA3 SEM (with Picoindenter)

Tescan - MIRA3 SEM (with Picoindenter)

Turnaround:

Cost10 business days

Description:

The Tescan MIRA3 SEM (Scanning Electron Microscope) with Picoindenter offers remarkable features designed for advanced materials analysis, including a maximum accelerating voltage of 30kV and exceptional resolution down to 1.2nm. This instrument is equipped with various detectors, including Secondary Electron Imaging and Backscattered Electron Detection, which facilitate versatile imaging capabilities across different modes, catering to high-resolution and large field-of-view requirements. Users benefit from the integrated Picoindenter, which enables precise nanomechanical testing with load capabilities of up to 500mN and an impressive maximum displacement of 150µm. The spacious sample chamber, with a maximum specimen height of 145mm, allows for the examination of larger samples, broadening testing possibilities across multiple applications in materials science. Overall, the combination of high-resolution imaging and detailed mechanical characterization makes the MIRA3 SEM an invaluable tool for researchers seeking in-depth insights into material properties and behaviors.

Specifications:

FeaturesSpecifications
Accelerating Voltage0-30kV
FilamentSchottky Field Emitter
DetectorsSecondary Electron Imaging – Everhart-Thornley Detector (ETD), Backscattered Electron Detector (WD > 8mm), EDS (WD = 15mm) – EDAX, EBSD (WD= 10-20mm) – EDAX Hikari Camera
SEM Resolution1.2nm
Imaging mode Resolution Mode (WD = 5-10mm)high resolution and low depth of focus
Depth Modegood resolution and increased depth of focus
Field Modelarge field of view, high depth of focus but worse resolution
Wide Field Mode (WD >25mm)extra large field of view but focus is not accurate
GM Chamber and Sample Stage Internal Diameter340mm (width) x 315mm (depth)
Maximum Specimen Height
  • 145mm without rotation stage
  • 116 with rotation stage
Maximum Specimen Weightup to 8kg
Movement
  • x,y: +/- 65mm
  • z: 0 to 100mm
Tilt+/- 90 degree
VacuumSputter Ion Pump for FEG and Molecular Drag Pump for chamber and column
PC and SoftwareSEM PC MIRA3 Control Software, EDAX PC TEAM for EDS and EBSD, OIM Analysis on EDAX PC for EBSD data analysis
Low Load Transducermaximum 15mN indent / 14mN tensile
High Load Transducermaximum 500mN indent / 100mN tensile
Maximum Displacement150um
Force Noise Floor inside SEMLL <0.4uN, HL<5uN
Force Noise Floor in ideal caseLL<50nN
Displacement Noise Floor inside SEM<1nm
Displacement Noise Floor in ideal case<0.1nm
Sample Positioning Range12mm (Z) x 26mm(X) x 29mm(Y indentation axis)
Tilt-rotation stagemaximum 400mN
In-situ heating elementsindentation at temperature up to 800C
ProbesStandard Berkovich (1), Flat-end (3): 1um, 5um, 20um, Cube corner (1), Cono-spherical (1) tip radius less than 1um, 800C Berkovich (1) for heating stage only

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